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400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board

400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board

Sale price Rs.160.00
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Pickup available at 16 Hall Road

Usually ready in 24 hours

400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board

400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
400 Tie Points Half Size Solderless Breadboard Solder Less Breadboard Prototyping Board
Sale priceRs.160.00
SKU: B411,krt111,IMP1000,Th500

The 400 Tie Points Half Size Solderless Breadboard is a versatile and user-friendly tool for prototyping and testing your electronic circuits. This high-quality breadboard offers a secure and efficient platform for connecting components without the need for soldering.

Key Features:

  • Versatile Design: 400 Tie Points Accommodates a wide range of components and circuits.
  • Solderless Connection: Easily connect and disconnect components without soldering.
  • Power Lanes: Provides dedicated power supply connections for convenience.
  • Durable Construction: Built to last with high-quality materials.
  • Compact Size: Ideal for various projects and workspace setups.

Specifications:

  • Tie Points: 400
  • Power Lanes: 100
  • Dimensions: 82mm x 55mm x 10mm
  • Maximum Voltage: 300V
  • Maximum Operating Current: 3-5A
  • Allowed Wire Size: 29-20 AWG

Order Now:

Streamline your prototyping process with our 400 Tie Points Half Size Solderless Breadboard. Experience the versatility and convenience of this essential tool.

 

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