Half-size breadboards are handy for most projects, and these versions include interlocking sections meaning you can join lots of these together to scale up for larger projects.

This transparent 400-point solderless breadboard features two 50-point power rails and a 30x10 point prototyping grid.

Pins are spaced by 2.54mm with a centre separation for separating DIP package chips. The rear of the board is self-adhesive for sticking to your project.

Also available in white. Don't forget to grab some jumper wires for connecting your components together.

Specifications

• Transparent ABS plastic allows you to see the inner connections of the breadboard
  
• 400 total tie-points:
  
  • 300 general prototyping tie-points
    
    • 2 columns of 30 rows of 5 interconnected tie-points
      
  • 100 power rail tie-points
    
    • 2 pairs of positive and negative power rails, one pair on each side of the breadboard
      
      • 25 interconnected tie-points per rail
        
• The two columns have a 0.3" (7.62mm) separation which allows for easy placement of DIP style package ICs
  
• Board-to-board side connectors on all four sides allow you to connect multiple breadboards together to form larger breadboards
  
  • The power rail pairs are attached to the main board with the same board-to-board connectors
    
    • You can remove the power rails from the main breadboard and cut the adhesive foam backing to make a smaller breadboard and independent power rail pairs
      
• Peel away paper protected self-adhesive foam backing to mount to projects or mounting plates
  
• For added fun use LEDs to illuminate the body of the breadboard
• Hole Spacing: 2.54mm (0.1")
  
• Acceptable Pin Sizes: 29-21 AWG
  
• Contacts: 2.54mm (0.1")
  
• Material: Nickel plated brass
  
• Rated Amperage: 2A
  
• Dimensions    
  
  • Length    82.55mm (3.25")
    
  • Width    54.61mm (2.15")
    
  • Height    8.38mm (0.33")

* Excluding the board-to-board side connectors and adhesive foam backing